1 / 4 www .asb.co.kr j u n e 201 7 p lerow tm aln0925bt internally matched lna module the plerow tm aln - seri es is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation te rminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implemen tation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production le vel. parameter unit specifications min typ max frequency range mhz 890 960 gain db 17 18 gain flatness db ? 0.4 ? 0.5 noise figure db 0.8 0.85 output ip3 (1) dbm 28 30.5 s11 / s22 (2) db - 14 / - 14 output p1db dbm 15 16.5 switching time (3) ? sec - supply current ma 60 70 supply voltage v 5 impedance ? 50 package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of 0 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 +vcc other s ground ou t line drawing (unit: mm) feature s s 21 = 18.4 db @ 890 mhz = 17.6 db @ 960 mhz nf of 0.8 db over fr e quency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes b e placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description (recommended footprint) aln0925bt asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 1 - stage single type typ. @ t = 25 ? c, v s = 5 v, freq. = 925 mhz, z o.sys = 50 ohm solder stencil area specifications (in pr o duction)
2 / 4 www .asb.co.kr j u n e 201 7 p lerow tm aln0925bt internally matched lna module s - param e ters noise figure oip3 p1db 890~960 mhz +5 v typical per formance (measured) s - parameters & k fa c tor 890 900 910 920 930 940 950 960 -30 -25 -20 -15 -10 -5 0 14 15 16 17 18 19 20 s12 s11 s22 s21 s21 [db] s11, s22, s12 [db] frequency [mhz] 0 1000 2000 3000 4000 5000 6000 7000 8000 9000 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 0 1 2 3 4 5 6 7 8 9 10 s12 s11 s22 s21 s - parameter [db] frequency [mhz] stability factor k
3 / 4 www .asb.co.kr j u n e 201 7 p lerow tm aln0925bt internally matched lna module 1. s - parameter 2. oip3, p1db & nf note: tested at room temperature. 1. s - parameter 2. oip3, p1db & nf note: tested at v s = 5 v . 890 mhz 925 mhz 960 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) 4.50 v 18.58 - 20.17 - 15.51 18.27 0.52 - 20.73 - 17.02 18.06 - 21.02 - 18.58 4.75 v 18.60 - 20.55 - 15.43 18.30 0.52 - 21.13 - 16.92 18.08 - 21.48 - 18.40 5.00 v 18.61 - 20.88 - 15.29 18.31 0.52 - 21.49 - 16.77 18.09 - 21.85 - 18.26 5.25 v 18.61 - 21.13 - 15.17 18.31 0.52 - 21.78 - 16.63 18.09 - 22.18 - 18.09 5.50 v 18.61 - 21.33 - 15.04 18.31 0.51 - 22.10 - 16.45 18.10 - 22.47 - 17.90 890 mhz 925 mhz 960 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) 4.50 v 29.32 16.44 0.703 29.78 16.07 0.692 28.93 16.05 0.671 4.75 v 29.08 16.84 0.684 29.58 16.59 0.665 28.65 16.51 0.684 5.00 v 28.84 17.25 0.697 29.32 17.00 0.685 28.41 16.97 0.730 5.25 v 28.73 17.64 0.729 29.27 17.44 0. 715 28.31 17.45 0.814 5.50 v 28.79 18.06 0.765 29.30 17.83 0.743 28.32 17.85 0.832 890 mhz 925 mhz 960 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) - 45 ? c 19.39 - 20.77 - 15.26 19.09 0.65 - 24.38 - 16.18 18.74 - 23.25 - 17.17 - 10 ? c 19.18 - 21.12 - 15.15 18.88 0.64 - 23.65 - 16.11 18.54 - 21.87 - 17.14 25 ? c 18.97 - 20.17 - 15.10 18.65 0.64 - 22.53 - 16.19 18.33 - 20.54 - 17.24 60 ? c 18.82 - 20.43 - 14.97 18.50 0.65 - 21.29 - 16.00 18.17 - 19.42 - 17.03 85 ? c 18.70 - 19.82 - 14.71 18.38 0.65 - 20.39 - 15.70 18.05 - 18.70 - 16.72 890 mhz 925 mhz 960 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) - 45 ? c 31.95 16.72 0.414 31.9 9 15.96 0.385 32.14 15.72 0.399 - 10 ? c 30.90 16.95 0.502 30.82 16.45 0.492 31.15 16.33 0.541 25 ? c 30.15 16.65 0.694 29.96 16.68 0.683 30.33 16.65 0.720 60 ? c 29.93 17.07 0.824 29.75 16.71 0.825 30.20 16.74 0.845 85 ? c 30.31 16.90 0.943 30.17 16.60 0.9 38 30.60 16.79 0.981 rf performance with operating temperature rf performance with voltage change
4 / 4 www .asb.co.kr j u n e 201 7 p lerow tm aln0925bt internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be dete r mined by customer s dc supp ly status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are included inside the lna module. there fore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e quency. copyright ? 2007 - 2017 asb inc. all rights reserved. datasheet subject to change without notice. asb assumes no re- sponsibility for any errors which may appear in this datasheet. no part of the datasheet may be copied or reproduced in any form or by any means without the prior written consent of asb. preliminar y application circuit recommended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln - at, bt, t series C 10x10mm)
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